Taiwan Semiconductor Manufacturing Co. (TSMC) is partnering with Taiwan’s Ministry of Economic Affairs and the Kaohsiung City Government to establish an advanced packaging hub in Baipu Industrial Park. The move directly addresses soaring demand for AI applications driving the company's packaging needs.
The initial three-hectare site will feature facilities for testing, validating, and developing advanced packaging materials and equipment. The hub will focus on Chip-on-Wafer-on-Substrate (CoWoS) technologies.
A new collaborative platform will allow suppliers to test hardware and software on-site. This integration is expected to improve overall validation efficiency by 25% to 50%. The facility will also serve as a training center for semiconductor specialists.