Samsung Electronics began shipping samples of its 12-layer HBM4E chips to major clients. This industry-first move places the company ahead of rival SK Hynix. SK Hynix does not plan to provide its HBM4E samples until the second half of 2026.
The accelerated timeline supports Samsung’s strategy to regain dominance in the AI memory sector. High Bandwidth Memory (HBM) powers AI accelerators used in global data centers.
The new 48GB chip delivers a 20% increase in speed compared to its predecessor. It also offers 16% better energy efficiency.