Samsung Electronics will use TSMC’s 3-nanometer process to produce base dies for NVIDIA’s upcoming custom High-Bandwidth Memory chips, known as NVHBM. This is the first time Samsung has collaborated with the Taiwanese chipmaker at the HBM manufacturing stage. NVIDIA aims to standardize its custom memory controller across suppliers.
NVIDIA has directed Samsung, SK Hynix and Micron Technology to use TSMC’s advanced process for the base dies. The core dies will use sixth-generation DRAM technology.
Samsung has accepted NVIDIA’s requirements for this product line. It will continue using its own production methods for standard HBM and other custom memory products. The company is also reportedly assessing whether its foundry could produce the base dies if demand exceeds TSMC’s capacity.