Samsung Electronics has started shipping samples of its 12-layer HBM4E memory to major global customers. The company claims an industry-first for this next-generation technology designed for AI systems and large language models.
The HBM4E memory delivers speeds of up to 16Gbps. Each stack provides a memory bandwidth of up to 3.6 terabytes-per-second. This represents a performance increase of over 20% compared to the HBM4 predecessor.
Initial samples feature a 48-gigabyte capacity, marking a 30% increase over the previous generation. The launch aims to solidify Samsung’s position against rivals in the high-performance memory market.