Huawei targets 1.4nm chip production by 2031, bypassing lithography restrictions

Huawei Technologies unveiled a new semiconductor manufacturing methodology to narrow the technological gap with industry leader TSMC. Semiconductor chief He Tingbo introduced the Tau (τ) Scaling Law and LogicFolding technology at the IEEE International Symposium in Shanghai. This approach aims to bypass limitations caused by restricted access to extreme ultraviolet (EUV) lithography equipment.

Huawei expects to achieve transistor density equivalent to 1.4-nanometers by 2031. This timeline trails TSMC’s projected 2028 mass production of 1.4nm chips by three years. The strategy seeks to eliminate reliance on advanced ASML machinery for future chip generations.

This initiative supports Beijing’s drive for semiconductor self-sufficiency amid US export controls. While the 2031 target remains unproven at scale, the move signals China’s focus on internal innovation to overcome supply chain hurdles. The development impacts the outlook for technology and growth ETFs tracking the critical chip sector.