Huawei Technologies introduced the Tau Scaling Law and LogicFolding architecture at the IEEE ISCAS 2026 in Shanghai. This semiconductor design framework aims to produce chips equivalent to a 1.4-nanometer process by 2031.
The method prioritizes vertical 3D stacking and signal transmission speed over traditional transistor shrinkage. This approach allows Huawei to develop high-performance AI and smartphone chips without restricted Extreme Ultraviolet (EUV) lithography machines.
Shares of Chinese chipmaker SMIC surged by more than 7% following the announcement. Global semiconductor firms are monitoring the potential disruption to Western supply chains.