Xiaomi unveiled its in-house Xring O3 processor. TSMC will manufacture the chip using its advanced 3-nanometer technology. The processor will power Xiaomi's upcoming flagship foldable smartphone.
This collaboration supports Xiaomi’s strategy to reduce reliance on external chip suppliers. The company also contracted TSMC for two additional projects. These include a 6-nanometer neural processing unit for AI and a 3-nanometer chip for autonomous driving.
Xiaomi plans to deploy both additional chips next year. This expanded partnership highlights growing demand for TSMC’s leading-edge manufacturing nodes.