TSMC has reportedly begun mass production of Xiaomi’s new Xring O3 smartphone processor. This chip utilizes TSMC’s advanced 3-nanometer production process. Xiaomi plans to feature the processor in its upcoming flagship foldable phone.
The move supports Xiaomi’s strategy to develop proprietary core components. This strategy aligns the company with rivals like Apple and Samsung in pursuing vertical integration.
Xiaomi also contracted TSMC to produce the Xring O100 neural processing unit. This AI-focused chip uses a 6-nanometer production process. Additionally, TSMC will manufacture the Xring D100, a 3-nanometer chip designed for autonomous driving.