Taiwan Semiconductor Manufacturing Company (TSM) and Amkor Technology (AMKR) signed a 10-year partnership for advanced semiconductor packaging in the United States. This agreement establishes a framework for TSMC to utilize Amkor’s packaging and testing services.
Both companies are currently constructing new facilities in Arizona to support the collaboration. Amkor is building an advanced packaging and test campus to serve TSMC’s new semiconductor fabrication plants in the state.
The partnership aims to accelerate production for high-performance computing and artificial intelligence. Localizing the entire production process will streamline the domestic semiconductor supply chain.