SK hynix CEO Kwak Noh-jung predicts a global memory chip shortage will persist through 2030. Rapid expansion in the artificial intelligence sector is driving this sustained demand.
The company recently broke ground on a $4 billion advanced packaging facility in Indiana. This site will produce next-generation High-Bandwidth Memory (HBM). Mass production is scheduled to begin in the second half of 2029.
The Indiana plant aims to strengthen the U.S. semiconductor supply chain. Kwak indicated that SK hynix remains open to additional U.S. investments to meet surging demand and capitalize on the AI boom.