SK hynix will hold a groundbreaking ceremony on August 27 for its new advanced chip packaging facility in West Lafayette, Indiana.
The project represents a $3.87 billion investment to expand the company's U.S. presence in the artificial intelligence sector. The facility will include a dedicated research and development center for high-bandwidth memory (HBM).
Top executives from SK Group and SK hynix will attend the event alongside key customers and partners. This investment is supported by the U.S. CHIPS Act to strengthen the supply chain for AI processors.
Mass production at the new plant is scheduled to begin in the second half of 2028.