SK hynix unveiled its next-generation memory technology roadmap at the 2026 Future Forum. The roadmap focuses on 3D-stacked chips and memory customized for specific AI workloads. These solutions aim to provide faster and more efficient data storage for sophisticated AI systems.
CEO Kwak Noh-jung announced a shift from speed-based competition to navigating complex market environments. The company plans to transition from a device supplier to a full-stack AI memory creator. SK hynix will co-design entire AI systems with partners to deepen integration into the AI value chain.