SK Hynix is investing $12.85 billion in a new memory packaging facility to meet surging demand for AI applications. The plant will increase the company's high-bandwidth memory (HBM) production capacity by approximately 30%.

This move directly challenges Micron Technology, which previously announced its HBM supply is sold out through 2026. The investment underscores the intensifying competition between SK Hynix, Micron, and Samsung to dominate the high-value AI accelerator market.