Micron Technology is ending development of 4F² DRAM architecture and shifting its focus to 3D DRAM. After researching 4F² for two decades, the company says the design offers no significant real-world density advantage over existing 6F² designs and brings higher manufacturing costs and complexity.
The strategy, announced by company executives, puts Micron on a different path from Samsung and SK Hynix, which are still developing 4F²-based products. Micron plans to keep scaling its current 6F² architecture while developing 3D DRAM as a long-term way to increase memory density.
Wedbush analysts believe Micron’s distinct approach could help it maintain a competitive edge.