SK Hynix announced the factory upgrade plan on October 21, 2026. The company is upgrading its factories in China to produce NAND memory chips with more than 200 layers, aiming to compete with local rivals and meet strong AI-driven demand.
SK Hynix is also reportedly in discussions with its supply chain to prepare for the application and production of iHBM. The moves are being made in consultation with the U.S. government because of export controls on chip-making equipment.
In separate news that day, SK Hynix confirmed it had completed a KRW 40 trillion treasury stock buyback. The program finished about a month ahead of schedule, returning capital to shareholders. The company’s shares rose 5.81% that day.