Advanced Substrate Technologies (AST), a joint venture between Broadcom and TOPPAN Holdings, has opened a new manufacturing facility in Singapore. It is the first facility in the country capable of producing high-end Flip Chip Ball Grid Array (FC-BGA) substrates, components used in advanced semiconductors for AI, networking and next-generation computing.
The plant is designed to address a persistent global shortage of advanced substrate capacity. Demand from generative AI and data centers has outpaced supply.
The opening marks a step in diversifying Singapore’s semiconductor ecosystem and aims to strengthen the resilience of the broader semiconductor supply chain.
The facility spans approximately 95,000 square meters and includes solar panels and advanced water recycling.