ASML is developing hybrid bonding equipment to enter the back-end semiconductor packaging market.
Korean media outlet The Elec reports the company has started architectural design for these systems. ASML is collaborating with supply chain partners Prodrive Technologies and VDL-ETG on the project.
The expansion follows previous statements from ASML’s CTO regarding potential opportunities in the packaging sector. Confirmed demand from memory manufacturers and rapid market growth are driving the initiative.
ASML intends to leverage its ultra-precise wafer stage motion technology currently used in EUV lithography machines. This expertise addresses the high-accuracy requirements essential for hybrid bonding.