Samsung Electronics began shipping samples of its 12-layer HBM4E high-bandwidth memory chips to global customers. This industry-first shipment positions the company to lead the next generation of artificial intelligence memory.
The release follows the start of mass HBM4 shipments just three months ago. The HBM4E memory delivers speeds over 20% faster than the previous HBM4 generation. Each stack provides a memory bandwidth of up to 3.6 terabytes per second.
The 12-layer configuration offers a 48-gigabyte capacity, representing a 30% increase over prior models. Samsung will begin mass production according to customer schedules. Key clients for these chips include AI hardware leaders Nvidia and AMD.