Google is negotiating with Samsung Electronics to manufacture a memory input-output (I/O) die for its next-generation AI chip, codenamed Icefish.
Samsung would produce the component using its advanced 2-nanometer process. Existing partner TSMC will continue to manufacture the main computing processor for the Tensor Processing Unit (TPU).
The strategy aims to diversify Google’s semiconductor supply chain amid capacity constraints at TSMC. For Samsung, the deal represents a significant opportunity to narrow the market gap with its primary rival.
The Icefish chip remains in development. Mass production could begin as early as 2028.