SK hynix will hold a groundbreaking ceremony on August 27. The company is investing $3.87 billion in a new advanced chip packaging plant in West Lafayette, Indiana. This facility represents the company's first advanced packaging site in the U.S.
The plant will focus on producing high-bandwidth memory (HBM) chips. These components serve as critical hardware for artificial intelligence applications.
Mass production at the facility is scheduled to begin in the second half of 2028. The project aims to strengthen the domestic U.S. AI supply chain through significant foreign investment.
SK hynix executives will attend the event. Reports suggest SK Group's chairman and Nvidia's CEO may also be in attendance.