Intel has appointed Lee Seok-hee, the former CEO of memory giant SK hynix, as executive vice president of its foundry division. Lee previously worked at Intel for a decade and will now oversee advanced packaging, system integration, and back-end manufacturing.
The appointment strengthens Intel's focus on advanced packaging, a critical component for high-performance AI chips. Lee is credited with developing the market-leading high-bandwidth memory (HBM) business at SK hynix.
Industry analysts suggest the move signals a potential partnership to secure stable HBM supplies for Intel’s logic chips. This follows May 2026 reports that both companies were exploring the integration of Intel’s packaging technologies with SK hynix’s HBM products.